Study the Structure and Electrical Properties of Sn-9Zn-1Ag Solder Alloy
Abstract
In this paper, we studied the structure and electrical properties of the alloy of composition Sn-9Zn-1Ag solder alloy as example of metallic materials that is used in electronic applications. The alloy exhibited three phase mixtures, tetragonal Sn as a solid solution and Zn phase and AgZn intermetallic compound. The lattice parameters, a, and C of the tetragonal Sn were also calculated. The ternary alloy exhibited Ohmic behavior. Also, we described its variation with temperature and determined the temperature coefficient of resistivity (TCR).
Full Text: PDF
Abstract
In this paper, we studied the structure and electrical properties of the alloy of composition Sn-9Zn-1Ag solder alloy as example of metallic materials that is used in electronic applications. The alloy exhibited three phase mixtures, tetragonal Sn as a solid solution and Zn phase and AgZn intermetallic compound. The lattice parameters, a, and C of the tetragonal Sn were also calculated. The ternary alloy exhibited Ohmic behavior. Also, we described its variation with temperature and determined the temperature coefficient of resistivity (TCR).
Full Text: PDF
Browse Journals
Journal Policies
Information
Useful Links
- Call for Papers
- Submit Your Paper
- Publish in Your Native Language
- Subscribe the Journal
- Frequently Asked Questions
- Contact the Executive Editor
- Recommend this Journal to Librarian
- View the Current Issue
- View the Previous Issues
- Recommend this Journal to Friends
- Recommend a Special Issue
- Comment on the Journal
- Publish the Conference Proceedings
Latest Activities
Resources
Visiting Status
 Today |
175 |
| Yesterday |
173 |
| This Month |
3331 |
| Last Month |
4450 |
 All Days |
1281254 |
 Online |
6 |
